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[Translation from Japanese to English ] This machine is multi button where 1st chip of chip for receiving light is se...

Original Texts
本機は、受光用チップの1stチップを基板アライメント基準で搭載、2ndチップ以降を隣接するチップ間に対し相対的に高精度で搭載するマルチボンダです。

本機は、CANシステム及び特殊PKGに複数素子を高精度に搭載可能な全自動高性能ダイボンダーです。

動作順序は次の通り。
1)ローダから供給された上記PKGをシャトルにセット
2)チップ搭載位置を高精度で認識後
3)エポキシを塗布
4)ウエハーシートよりピックアップされたチップを高精度で認識位置決め
5)ボンディング
6)マガジンへの収納
[deleted user]
Translated by [deleted user]
This equipment is the multi-bonder which installs the first tip of photo receiving tip referenced to the substrate alignment, and then, installs the second tip and so on with high precision relative distances.

This equipment is automatic high performance dye bonder which is capable of installing the multiple components to CAN system and the special package with high precision.

The following is the operational procedure;
1. Set the above package supplied from the loader to the shuttle.
2. Align the tip installation position with high precision.
3. Apply the epoxy.
4. Align the position of the tip picked up from the wafer sheet with high precision.
5. Bonding.
6. Store to the magazine.

Result of Translation in Conyac

Number of Characters of Requests:
235letters
Translation Language
Japanese → English
Translation Fee
$21.15
Translation Time
31 minutes