本機は、受光用チップの1stチップを基板アライメント基準で搭載、2ndチップ以降を隣接するチップ間に対し相対的に高精度で搭載するマルチボンダです。
本機は、CANシステム及び特殊PKGに複数素子を高精度に搭載可能な全自動高性能ダイボンダーです。
動作順序は次の通り。
１）ローダから供給された上記PKGをシャトルにセット
２）チップ搭載位置を高精度で認識後
３）エポキシを塗布
４）ウエハーシートよりピックアップされたチップを高精度で認識位置決め
５）ボンディング
６）マガジンへの収納
Rating
50
Translation / English
- Posted at 17 Dec 2013 at 13:02
This machine is multi button where 1st chip of chip for receiving light is set subject to standard of substrate alignment and is set at high precision relatively for between chips that are located next after 2nd chip.
This machine is die bonder which automatically performs highly where plural particles are set at high precision in CAN system and special PKG.
Order of operation is as follows.
1)Set above PKG that is provided from loader at shuttle
2)After checking the place where chip is set at high precision
4)Coat epoxy
4)Decide recoginition place where chip picked up from wafer sheet at high precision
5)Bonding
6)Store into magazine
This machine is die bonder which automatically performs highly where plural particles are set at high precision in CAN system and special PKG.
Order of operation is as follows.
1)Set above PKG that is provided from loader at shuttle
2)After checking the place where chip is set at high precision
4)Coat epoxy
4)Decide recoginition place where chip picked up from wafer sheet at high precision
5)Bonding
6)Store into magazine
![[deleted user]](https://secure.gravatar.com/avatar/695023b4efd563721d13716b1457bc73.png?d=identicon&mode=crop&r=PG&s=42)
Rating
52
Translation / English
- Posted at 17 Dec 2013 at 13:05
This equipment is the multi-bonder which installs the first tip of photo receiving tip referenced to the substrate alignment, and then, installs the second tip and so on with high precision relative distances.
This equipment is automatic high performance dye bonder which is capable of installing the multiple components to CAN system and the special package with high precision.
The following is the operational procedure;
1. Set the above package supplied from the loader to the shuttle.
2. Align the tip installation position with high precision.
3. Apply the epoxy.
4. Align the position of the tip picked up from the wafer sheet with high precision.
5. Bonding.
6. Store to the magazine.
This equipment is automatic high performance dye bonder which is capable of installing the multiple components to CAN system and the special package with high precision.
The following is the operational procedure;
1. Set the above package supplied from the loader to the shuttle.
2. Align the tip installation position with high precision.
3. Apply the epoxy.
4. Align the position of the tip picked up from the wafer sheet with high precision.
5. Bonding.
6. Store to the magazine.
Rating
44
Translation / English
- Posted at 17 Dec 2013 at 12:54
this machine -- euphotic -- business -- it is multi-buttom which carries 1st chip of a chip with high precision relatively to between the chips which adjoin loading and 2nd chip or subsequent ones on a substrate alignment standard.
This machine is full automatic highly efficient Di Bonder which can be carried with high precision about two or more elements at a CAN system and special PKG.
An order of operation is as follows.
1) Apply [ the above PKG supplied from the loader ] after-recognition
2) chip loading position with high precision.
3 )epoxy to a shuttle for a set
4) It is recognition positioning
5) bonding at high precision about the chip taken up from the wafer sheet.
6) Storage to a magazine
This machine is full automatic highly efficient Di Bonder which can be carried with high precision about two or more elements at a CAN system and special PKG.
An order of operation is as follows.
1) Apply [ the above PKG supplied from the loader ] after-recognition
2) chip loading position with high precision.
3 )epoxy to a shuttle for a set
4) It is recognition positioning
5) bonding at high precision about the chip taken up from the wafer sheet.
6) Storage to a magazine
★☆☆☆☆ 1.0/1
