本機はパッケージの全周面を対象とした高速外観検査装置です。
外観ステージ部を最大10ステージまで追加構成することが可能。
同一画面上での２チップ位置決認識と位置決めを行うため高精度搭載が可能。
２品種チップ迄マルチ搭載が可能。
チップ搭載後の検査機能を有し精度の保証が可能。
MEMSチップに対応したピックアップが可能。
多品種のステムに対応可能。
多数チップ/同一パッケージの製品に対応可能。
チップ搭載後の検査機能を有し精度の保証が可能。
評価
50
翻訳 / 英語
- 2013/12/19 13:20:42に投稿されました
This machine is equipment for inspecting outside at high speed for all aspects of package.
It is possible to add outside stage up to 10 at maximum.
It is possible to recognize position of 2 chips on the same screen and set at high precision to decide the position.
It is possible to set up to 2 types of chip at maximum.
It has inspection function after setting the chip, and guarantees precision.
It is possible to pick up in accordance with MEM chip.
It is applicable to many types of system.
It is applicable to many chips and product of the same package.
It has inspection function after setting chip, and guarantees precision.
It is possible to add outside stage up to 10 at maximum.
It is possible to recognize position of 2 chips on the same screen and set at high precision to decide the position.
It is possible to set up to 2 types of chip at maximum.
It has inspection function after setting the chip, and guarantees precision.
It is possible to pick up in accordance with MEM chip.
It is applicable to many types of system.
It is applicable to many chips and product of the same package.
It has inspection function after setting chip, and guarantees precision.
評価
57
翻訳 / 英語
- 2013/12/19 13:27:49に投稿されました
This is a fast appearance inspection device for all peripheral surfaces of a package.
Maximum ten stages can be added to the appearance stage.
It can be equipped with high-precision to recognize two chip positioning on the same screen and do the positioning.
Maximum two types of chips can be mounted on it.
It has accuracy with an inspecting function after mounting chips.
It can do MEMS chip-compliant pickup.
It can correspond to multi-kind stems.
It can correspond to a product of multi-chip / same package.
It has accuracy with an inspecting function after mounting chips.
Maximum ten stages can be added to the appearance stage.
It can be equipped with high-precision to recognize two chip positioning on the same screen and do the positioning.
Maximum two types of chips can be mounted on it.
It has accuracy with an inspecting function after mounting chips.
It can do MEMS chip-compliant pickup.
It can correspond to multi-kind stems.
It can correspond to a product of multi-chip / same package.
It has accuracy with an inspecting function after mounting chips.
