Eiko (gloria) Translations

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A listing of the public translations that were written by this user. This listing does not include the requests that have yet to be completed.
gloria Japanese → English
Original Text

オイルポンプからシリンダーヘッドに流れるエンジンオイルボルトを交換してエンジンオイルの吐出配分量を増幅させます。そして純正オイルボルトより早い潤滑を促進させ、ロッカーアームやカムシャフトの耐磨耗性を向上させカジリや削れを防止するパーツセットです
エンジン発生熱による油温の上昇率は、ツーリングやレースも含め、ノンストップ走行より短距離走行の方が油温は下がりにくいのです。エンジンヘッド内は想像より高温となり、ロッカーアームやカムシャフトの接触面に悪影響を与え金属磨耗も早い傾向です。

Translation

This parts set is for exchanging the bolt for the engine oil flowing from the oil pump toward the cylinder head to amplify the discharging amount of the engine oil. This set further promotes faster lubrication than the pure engine oil bolt to improve the abrasion resistance of the locker arm and the cam shaft so that the scoring and/or scraping can be avoided. As for the rising rate of the oil temperature caused by the heat produce by the engine, both in touring and racing, oil temperature is harder to drop in short distance running than in non-stop running. The temperature inside the engine is higher than we imagine, and it affect negatively to the contacting surface of the locker arm and the cam shaft, accordingly the abrasion of metal also tends to be faster.

gloria Japanese → English
Original Text

本機はマガジンケースに収納されているハイブリッド基板(ICやコンデンサー等を搭載)を一枚ずつ測定部に供給、指定の温度で電気的特性検査を行い、その後良品と不良品に分類し、各々のマガジンケースに収納する装置です。

また、空になったマガジンを収納側へ搬送して使用する仕様を付加することも可能です。

同時搭載可能チップは2種類あり、ダイサリング及びチップトレーにて供給します。

基板の供給と収納は、マガジン単位で行います。

また、素子搭載後の検査機能を有しボンディング後の品質管理が可能です。

Translation

This device feeds the hybrid circuit boards (mounted with IC, condensor, etc.) one by one, which is housed in the magazine case, to the measuring point, and then conducts the inspection of electirical properties at a designated temperature, and further sorts the measured circuit boards to defective and non-defective ones, and finally place them into respective magazine cases.

A function can be added as an option, with which emptied magazines can be forwarded to the housing side.

There are two chips which can be mouted simultaneously, for feeding either by dicering and by the chip tray.

Feeding and housing of the circuit boards are done by each magazine basis.

This also has the function of inspection after the module is mounted, so it is possible to control the quality after bonding .