本機はセラミック基板の「ソリ」及び「個片パターンのコプラナリテイ」を三次元画像で合否判定する検査装置です。
特徴
高精度にて三次元検査が可能。 （高さ分解能：１．８μm）
３次元検査視野が広く、検査処理時間の短縮が可能。
検査処理時間が短く、前後工程とのインライン対応が可能。
導通検査ステージをオプションにて取付けることが可能。
トレー to トレー での高速処理を実現。
This unit is the inspection device that determines pass or fail about "warp" and "Kopuranaritei of pattern pieces" of the ceramic substrate by three dimensions image.
Features
It can three-dimensional Examination with high accuracy. (height resolution: 1.8μm)
Field of view in examination by three-dimensional is wide, it can be shortened processing time of Examination.
Processing time of examination is short, and can support by in-line between before and after of the process.
It can attach with the inspection by conduct stage as option.
The high-speed processing in the tray to tray.
