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[Translation from Japanese to English ] A complex system device for dividing the individual substrate from sheet subs...

Original Texts
本機は、シート基板から個片基板を分割する装置と、セラミックチップを短尺状リードフレームに貼付ける装置からなる、複合システムです。

特徴

実装済基板の分割が可能。

分割後の寸法検査機能を有している。

バットマーク付不良基板の排除機能を有している。

搭載時のスクラブ併用により貼付け品質の安定を実現。

接着剤の塗布方法は2方式(転写、ディスペンス)より選択可能。

検査ヘツドはワンタッチで品種交換可能。

常温、高温等多種のテストステージ選択が可能。

Translated by summerld_516
A complex system device for dividing the individual substrate from sheet substrate, mounting the ceramic chip to the short-length shape lead frame.

Features
It's possible to be divided into units for assembled board.
And it has a dimensional inspection function after the sectioning.
And it has the function to exclude the bad boards with the marking.
It has the stability of quality when pasting combined scrubs for build-in
2 Methods of applying the adhesive can be selected (transfer, dispense) .
Inspection heads interchangeable with one touch.
It's available for the varieties of test stage selection such as at room temperature, high temperature, etc.

Result of Translation in Conyac

Number of Characters of Requests:
223letters
Translation Language
Japanese → English
Translation Fee
$20.07
Translation Time
23 minutes
Freelancer
summerld_516 summerld_516
Starter