ヒートテスターは、加熱装置を搭載した形状検査装置です。
非接触でガラス面を基準としてリフローの温度シミュレーションで加熱をおこない、温度によるワークの変化量を面で計測することができます。
測定結果は、感覚で判る3次元画像データと数値データで保存できますので、リフロー時のはんだ不良の特定や、高温の場所で使用する部品の形状変化測定などにご使用いただけます。
今までの点計測の常識を覆す「面計測」による高速形状測定
今まで見れなかった樹脂の反りやうねりも同時に測定
ガラス接地箇所をすばやく把握
評価
55
翻訳 / 英語
- 2013/12/11 12:59:16に投稿されました
Heat Tester is the shape inspection apparatus equipped with a heating device.
It is possible to perform heating simulating the reflow temperature based on the glass surface without contact and measure in terms of variation of the work due to the temperature.
Since the measurement results can be saved in 3D image data judged by sensation and numeric data, it could be used in solder failure during reflow and shape change measurement of parts used in high temperature places.
"surface measurement”— High-speed shape measurement overturns the common sense of the point measurement.
Swell and warp of the resin can’t be observed until now which can be measured at the same time.
Quickly understand the glass ground point
It is possible to perform heating simulating the reflow temperature based on the glass surface without contact and measure in terms of variation of the work due to the temperature.
Since the measurement results can be saved in 3D image data judged by sensation and numeric data, it could be used in solder failure during reflow and shape change measurement of parts used in high temperature places.
"surface measurement”— High-speed shape measurement overturns the common sense of the point measurement.
Swell and warp of the resin can’t be observed until now which can be measured at the same time.
Quickly understand the glass ground point
★★★★★ 5.0/1
評価
41
翻訳 / 英語
- 2013/12/11 12:52:45に投稿されました
Heat Tester is shape inspection apparatus equipped with a heating device.
On the basis of the glass surface without contact
Heating is carried out at a temperature of the reflow simulation,
And can measure in terms of variation of the work due to temperature.
The measurement results, you can save numerical data and three-dimensional image data seen in the sense.
So, you can use to measuring about specific failure of the solder during reflow and such as change of shape measurement for parts to be used in place of high temperature
High-speed shape measuring by "surface measurement" that overturn the common sense of the point measure until now.
Swell and warp of the resin that was not able to see until now is also measured at the same time.
Quickly grasp the point of glass ground.
On the basis of the glass surface without contact
Heating is carried out at a temperature of the reflow simulation,
And can measure in terms of variation of the work due to temperature.
The measurement results, you can save numerical data and three-dimensional image data seen in the sense.
So, you can use to measuring about specific failure of the solder during reflow and such as change of shape measurement for parts to be used in place of high temperature
High-speed shape measuring by "surface measurement" that overturn the common sense of the point measure until now.
Swell and warp of the resin that was not able to see until now is also measured at the same time.
Quickly grasp the point of glass ground.
評価
44
翻訳 / 英語
- 2013/12/11 13:14:18に投稿されました
Heat Tester is shape inspection apparatus equipped with a heating device.
It is possible to perform heating at a temperature reflow simulation, based on the glass surface without contact, and is measured in surface of the change of the work due to temperature.
The measurement results, as you can save as numeric data and three-dimensional image data seen in the sense, it is available to identify of solder failure duing reflow and measure the change of part's shape to be used in place of high temperature.
High-speed shape measurement is overturned the common sense of the point measurement until now by "the surface measurement".
Swell and warp of the resin I was not able to see until now is also measured at the same time.
Quickly catch the glass fitting point.
It is possible to perform heating at a temperature reflow simulation, based on the glass surface without contact, and is measured in surface of the change of the work due to temperature.
The measurement results, as you can save as numeric data and three-dimensional image data seen in the sense, it is available to identify of solder failure duing reflow and measure the change of part's shape to be used in place of high temperature.
High-speed shape measurement is overturned the common sense of the point measurement until now by "the surface measurement".
Swell and warp of the resin I was not able to see until now is also measured at the same time.
Quickly catch the glass fitting point.
