本機はマガジンケースに収納されているハイブリッド基板（ICやコンデンサー等を搭載）を一枚ずつ測定部に供給、指定の温度で電気的特性検査を行い、その後良品と不良品に分類し、各々のマガジンケースに収納する装置です。
また、空になったマガジンを収納側へ搬送して使用する仕様を付加することも可能です。
同時搭載可能チップは2種類あり、ダイサリング及びチップトレーにて供給します。
基板の供給と収納は、マガジン単位で行います。
また、素子搭載後の検査機能を有しボンディング後の品質管理が可能です。
This device feeds the hybrid circuit boards (mounted with IC, condensor, etc.) one by one, which is housed in the magazine case, to the measuring point, and then conducts the inspection of electirical properties at a designated temperature, and further sorts the measured circuit boards to defective and non-defective ones, and finally place them into respective magazine cases.
A function can be added as an option, with which emptied magazines can be forwarded to the housing side.
There are two chips which can be mouted simultaneously, for feeding either by dicering and by the chip tray.
Feeding and housing of the circuit boards are done by each magazine basis.
This also has the function of inspection after the module is mounted, so it is possible to control the quality after bonding .
